’s-Heerenberg/Eindhoven, The Netherlands, July 4th, 2025 – Powertrim Technologies, the global leader in high performance handling, assembly and testing technology for automated power electronics manufacturing and Tooling Specialist Derksen (TSD), with 27 years of experience in high-precision parts manufacturing and semiconductor back-end tooling, have joined forces and will continue as one group: Powertrim International. The group is backed by technology investor ESquare Capital Partners to accelerate international growth and deliver upon their joint ambition to become the preferred global partner for advanced power module packaging equipment and tooling in high-end automotive, sustainable energy and industrial applications. Simultaneously, the owners of Tooling Specialist Derksen, Frans Derksen and Erik van Ouwerkerk will continue to be minority shareholders in the newly formed group.
‘We are proud to be re-united with the company that in 2020 gave birth to Powertrim Technologies and continue to collaborate intensively with the craftsmen that have manufactured so many complex tooling sets for general and power electronics over the years. We are convinced that the combination of the only dedicated production platform for high voltage power electronics and in-house engineering and fabrication of advanced tooling allows for turn-key solutions for our customers with the lowest total cost of ownership’, said Daan Kersten, CEO of Powertrim International. ‘As founder of TSD, I’m grateful to have secured access of our customers to our manufacturing expertise in toolmaking and precision part production as well as the long-term future of our heritage. The team we built over the course of 25+ years is in good hands and will continue to expand, added Frans Derksen. ‘We trust the experienced leadership of Powertrim to accelerate the expansion of this new group and are proud to join them on their journey while leveraging our network and sector expertise’, concluded Jules Bernaerts, Managing Partner of ESquare Capital Partners.
